Processes used in fabrication of modern integrated circuits. Process steps for crystal growth, oxidation, diffusion, ion implantation, lithography, chemical vapor deposition, etching, metallization, layout and packaging. Process integration for MOS and biopolar processes. Characterization techniques, simulation, yield and reliability.
Additional course information provided by the department:
Introduction to the individual process steps used to fabricate semiconductor Integrated Circuit Chips starting with the refinement of raw materials and finishing with the packaging of completed chips. The integration of these component processes into state-of-the-art CMOS and bipolar device technologies is considered.