| ECE 544 |
Design Of Electronic Packaging and Interconnects |
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A study of the design of digital and mixed signal interconnect and packaging. Topics covered include: Single chip (surface mount and through-hole) and multi-chip module packaging thecnology; packaging techology selection; thermal design; electricaldesign of printed circuit board, backplane and multi-chip module interconnect; receiver and driver selection; EMI control; CAD tools; and measurement issues. |
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| Pre-Requisites: | ECE 302 |
| Co-Requisites: | None |
| Restrictions: | Department Consent Required |
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Credits: 3
Spring '12 Instructors: Evans B
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Course Listings
