"Monolithic Copper Integrated Circuitry supporting
Multi-layer MEMS"
Phase Two Finalist, SRC Copper Design Challenge
Phase One Downloads:
Phase1
Report (PDF) , (Compressed
PS)
ISSCC
Poster (PDF)
Design Team Members: David
Winick, Bruce Duewer, Alan Glaser, David Nackashi, John Wilson
Affiliation: North Carolina State University
Contact: David Winick, EGRC Bldg., Rm. 438, 1010 Main Campus
Dr., NCSU, Raleigh, NC 27695-7914
Abstract
In this entry we explore post-processing of the UMC Cu chip for distributed
micro-systems design. Microsystems technology involves the creation of
sensors and/or actuators integrated with control circuitry. This is also
sometimes termed systems-on-a-chip ("SoC"). Currently available processes
for such systems either limit the designer to very simple mechanics (e.g.,
iMEMS), or to a lateral separation of the mechanical and circuitry planes
(e.g., M3S, or SmartMUMPs). For advanced micro-systems applications, such
as distributed control of "smart" sensor/actuator arrays, better integration
is necessary. The eventual availability of the UMC Copper process, in combination
with our development of a post-process release sequence, will make viable
the design of such systems. Higher melting points, electromigration resistance,
Damascene etch barriers and CMP planarity make Copper attractive for post-processing.
Our chip development efforts include design of a post-process sequence,
structures for process monitoring of that sequence, structures for determination
of copper thin-film mechanical properties, and a state-of-the-art micro-system
array that will demonstrate feasibility of distributed sense and control
in the UMC Cu process.
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