3DIC and 3D Packaging

Dr. Paul D. Franzon

paulf@ncsu.edu

919.515.7351, fax. 919.515.2285
www.ece.ncsu.edu/erl/faculty/paulf.html

Brief Description

Stacking of silicon chips using Through Silicon Vias (TSVs) establishes the potential for high density, high performance 3D systems. 3D packaging permits further miniaturization of such systems. In these projects, we are pursuing the following goals:

• Establishing the value proposition for these technologies. How can they be leveraged to bring significant performance advantages?
• Establishing the CAD tools required to design 3DICs and 3D packaging.
• Distributing parts of these CAD tools to support design in the DARPA supported Multi Project Wafer runs at Lincoln Labs, and at Tezzaron
• Supporting Irvine Sensors Corporation in the design of a new highly integrated 3D Packaging structure

We gratefully acknowledge the support of DARPA, AFRL, MARCO and SRC in this work.

Selected Publications

• T. Thorolfsson, K. Gonsalves, and P.D. Franzon, "Design automation for a 3DIC FFT processors for synthetic aperture radar," A case study, in Proc. ACM/IEEE DAC, July 26-31, 2009, pp. 51-56. paper
• W.R. Davis, E.C. Oh, A.M. Sule, and P.D. Franzon, "Application Exploration for 3-D Integrated Circuits: TCAM, FIFO, and FFT Case Studie," Vol. 17, No. 4, April 2009, pp. 496-506. paper
• P.D. Franzon, et.al., “Design and CAD for 3D Integrated Circuits”, IEEE/ACM Design Automation Conference, June 2008, 8-13 June 2008, pp. 668-673. paper
• T. Thorolfsson, P.Franzon, "System Design for 3D Multi-FPGA Packaging," in Proc. 2007 IEEE EPEP, 28-31 Oct., 2007, pp. 171-4. paper
• E.C Oh, P.D. Franzon, “Design Considerations and Benefits of Three-Dimensional Ternary Content Addressable Memory, in IEEE CICC, Sept. 2007, pp. 591-594.  paper
• W.R. Davis,  J. Wilson, S. Mick, J. Xu, H. Hua, C. Mineo, A.M. Sule, M. Steer, P.D. Franzon , “Demystifying 3D ICs: the pros and cons of going vertical,” IEEE Design and Test of Computers, Vol. 22, No. 6, Nov-Dec. 2005, pp. 498-510. paper
• S.F. Al-sarawi, D. Abbott, and P. Franzon, “A review of 3D Packaging Technology'', IEEE Transactions on Components, Packaging and Manufacturing Technology, Feb. 1998, Vol. 21, No. 1, pp.2-14. paper

.