MultiMode Interconnect
Dr. Paul D. Franzon
919.515.7351, fax. 919.515.2285
www.ece.ncsu.edu/erl/faculty/paulf.html
Brief Description
With higher core clock speeds, and the trend to multi-core, the demands on chip I/O are increasing rapidly. The key question is how to increase both the density and speed of chip I/O without increasing packaging costs. At high speeds, crosstalk issues typically dictate inter-pair spacings of four times the wire width in PCBs, and rich use of power and ground shields in connectors. In this research, we will investigate coding and circuit techniques that enable a group of signals to travel down a wire bundle, and potentially connectors and cable assemblies, without crosstalk
We thank Intel and SRC for support of this project.
Selected Publications
Y. Choi, C. Won, P.D. Franzon, H. Braunisch, and K. Aygun,“Multimode signaling on non-ideal channels,“ in IEEE EPEP 2008, Oct. 2008, pp. 51-54. paper
Y. Choi, H. Braunish, K. Aygun and P.D. Franzon, “Analysis of inter-bundle crosstalk in multimodel signaling for high density interconnect,” in Proc. 2008 Electronic Components and Technology Conference, pp. 664-668, May 2008. paper