Lei Luo received the Intel Best Student Paper Award at the 14th IEEE Electrical Performance of Electronic Packaging Conference

December 02, 2005

Lei Luo, a graduate student working with Dr. Paul Franzon (Alumni Distinguished Professor in the department of ECE), received the Intel Best Student Paper Award at the IEEE-EPEP 2005, the 14th IEEE Electrical Performance of Electronic Packaging Conference held in Austin, TX between Oct.24 and Oct.26, 2005, for his paper titled "Signal Integrity and Robustness of ACCI Packaged Systems". Dr. John Wilson, Jian Xu, Dr. Stephen Mick and Dr. Paul Franzon are co-authors of this paper.

Dr. Franzon and his students first proposed the AC Coupled Interconnect (ACCI) concept at IEEE-CICC in 2002. This technology provides a systematic solution for high speed chip to chip communications through ultra-high I/O density and with lower power dissipation. This paper discusses the signal integrity aspects and robustness of ACCI packaged systems. Key techniques are proposed to reduce the switching noise, crosstalk and ISI associated with ACCI and its Return-to-Zero (RZ) pulse signaling. More information about the ACCI project can be found at The ACCI Page.