Steer to present at SEMATECH Workshop on 3D Chips

September 26, 2007

Dr. Michael Steer, ECE Department, NC State University
Dr. Michael Steer, ECE Department, NC State University

Dr. Michael Steer of the Department of Electrical and Computer Engineering at NC State University and Michael Fritze of DARPA will be presenting at the SEMATECH Workshop on 3D Chips.  His topic, "Thermal Challenges in DARPA's 3DIC Technology Portfolio", seeks to address the topic of the workshop - the thermal and design challenges of 3D IC technology.  3D IC technology aims for greater IC functionality by stacking silicon chips and connecting them with through-silicon vias.

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