Campus Box 7911
NC State University
Raleigh, NC 27695-7911
I received a BS in Mechanical Engineering and a BS in Electrical Engineering from North Carolina State University (1983). I joined RTI International as a Principal Research Scientist in May 2004. Prior to joining the staff at RTI, I spent time in varying positions with several start-up ventures most recently as an ASIC Development Engineer for ISIC Corporation. My specialty is Micro Controller based System Architecture and Design. I have created several low power hand held sensor systems; designed at the system, board and, chip level, created production ready systems and created regression test systems, provided out source management and manufacturing process optimization. I have extensive experience with System Architecture, Microprocessor / Microcontroller board level Designs, Embedded Firmware Development, Electronic Packaging, Safety and Security Compliant Standards, and System Level Production Process Development. My current research is the development of mixed mode Low Voltage / High Voltage ASICs in support of MEMS Actuators and in creating low power Hand Held demonstration units for Sensor Systems.
My hobbies are electronic tinkering and flying.
- 1983 - BS in Electrical Engineering, N C State University, Raleigh NC
1983 - BS in Mechanical Engineering, N C State University, Raleigh NC
| Selected Publications
- Rodes, C. E., Newsome, J. R. , Carlson, J., "The RTI MicroPEMTM . “Designing and Testing a Next-Generation Personal Exposure Monitoring Platform for Difficult Cohorts” , presented at 2007 International Society for Exposure Analysis Annual Meeting, Durham, NC, October 4 2007, RTI International, Research Triangle Park, NC, 27709
- Feng, Z., C. A. Bower, J. Carlson, M. Lueck, D. Temple and M. B. Steer. 2007. “High-Q Solenoidal Inductive Elements” International Microwave Symposium Conference 2007, TH4G-04.
- Carlson, J., M. Lueck, C. A. Bower, D. Temple, Z. –P Feng M.B. Steer, A.J. Moll and W.B. Knowlton. 2007. “A Stackable Silicon Interposer with Integrated Through-Wafer Inductors” The 57th Electronic Components and Technology Conference 2007, p444